XFC-300 / XFC-301 (熱風式SMT返修裝置)

●能設定PREHEAT1、PREHEAT2、PREHEAT3、REFLOW、COOL DOWN 5個區域的記錄。●LIFT、PLACE模式能寄存5個區域,每區域19種設定溫度。HAND模式能寄存1種設定溫度。●PID控制、實現精確溫度管理。●手柄處配有熱源ON-OFF開關以及真空ON-OFF開關、操作方便。●配有能預熱ON-OFF功能介面。(連接控制線為選購件)●有鎖定功能。●按COOL鍵、對全區域冷卻。●自動記錄功能。 ＊過程記錄由5個區域構成。能設定每個區域的溫度和時間。

XPR-600 (預熱台 )

使用者可根據自己要求，與熱風式SMT返修系統、手柄支架、XY調節器、PCB支架組成不同的系統。 大型機板/大型元件對應，從電阻元件到BGA返修所有元件 ●熱風式加熱，升溫快、壽命長、高效率。 ●使用溫度感測器回饋系統，對溫度實施精確管理 ●冷風模式可冷卻PCB，縮短作業時間 ●搭配XFC-300熱風式SMT返修系統，ON/OFF控制可能。 ●可用於機板的預熱，及其他需要整體均勻加熱的工藝。 ●XFC-300設計小巧。 ●溫度數碼顯示一目了然。 ●防靜電設計

GSR-200

By combining the XPR-600 Preheater with the XFC-200 Convection Rework Tool which handles QFPs/SOLs, rework of large SMDs is possible with increased efficiency at an economical price.

XPR-600 (Preheater)

This is a hot air type preheater with digital temperature display and a wide output opening to allow a large area to be heated. This assures PCBs are not damaged during reworking.

XFC-200 (Convection SMT rework tool)

With a wide temperature range from 150–450°C and airflow volume range from 5–20 l/m it handles reworking of various SMDs and PCBs. A wide variety of interchangeable nozzles are available in the XFC Series.