XFC-300 / XFC-301 (热风式SMT返修装置)

●能设定PREHEAT1、PREHEAT2、PREHEAT3、REFLOW、COOL DOWN 5个区域的记录。●LIFT、PLACE模式能寄存5个区域,每区域19种设定温度。HAND模式能寄存1种设定温度。●PID控制、实现精确温度管理。●手柄处配有热源ON-OFF开关以及真空ON-OFF开关、操作方便。●配有能预热ON-OFF功能接口。(连接控制线为选购件)●有锁定功能。●按COOL键、对全区域冷却。●自动记录功能。 ＊过程记录由5个区域构成。能设定每个区域的温度和时间。

XPR-600 (预热台 )

使用者可根据自己要求，与热风式SMT返修系统、手柄支架、XY调节器、PCB支架组成不同的系统。 大型机板/大型组件对应，从电阻组件到BGA返修所有组件 ●热风式加热，升温快、寿命长、高效率。 ●使用温度传感器回馈系统，对温度实施精确管理 ●冷风模式可冷却PCB，缩短作业时间 ●搭配XFC-300热风式SMT返修系统，ON/OFF控制可能。 ●可用于机板的预热，及其他需要整体均匀加热的工艺。 ●XFC-300设计小巧。 ●温度数码显示一目了然。 ●防静电设计

GSR-200

By combining the XPR-600 Preheater with the XFC-200 Convection Rework Tool which handles QFPs/SOLs, rework of large SMDs is possible with increased efficiency at an economical price.

XPR-600 (Preheater)

This is a hot air type preheater with digital temperature display and a wide output opening to allow a large area to be heated. This assures PCBs are not damaged during reworking.

XFC-200 (Convection SMT rework tool)

With a wide temperature range from 150–450°C and airflow volume range from 5–20 l/m it handles reworking of various SMDs and PCBs. A wide variety of interchangeable nozzles are available in the XFC Series.